Yin amfani da high-frequency induction kayan aikin dumama da kuma matakan kariya don samar da induction coils

Na’urorin walda masu girma-girma, injina masu dumama shigar da wutar lantarki, masu dumama dumama dumama (welders), da dai sauransu. mai faɗi sosai, kuma taken ya bambanta dangane da filin aikace-aikacen. Daga cikin su, injin dumama, wanda kuma aka sani da na’ura mai yawan gaske. high-frequency induction kayan aikin dumama, Babban mitar shigar da kayan aikin dumama, babban ƙarfin dumama wutar lantarki, ƙarfin wutar lantarki mai ƙarfi, tanderun lantarki mai ƙarfi. Ya kamata masana’anta na induction coil ya kula da waɗannan batutuwa:

1. Dole ne nada ya zama mai ma’ana, kamar yadda zai yiwu zuwa ga abin da za a yi zafi. Ana iya yin wannan ƙa’idar tamani bisa ga yanki, daidaitawa, da yanki na abu mai zafi.

2. Zane na nada dole ne ya kasance mai ƙarfi kuma abin dogara, kuma ba zai iya motsawa ba lokacin da aka sanar da ikon, kuma kada ya taɓa abubuwa.

3. Zane na nada dole ne ya nemi dacewa.

4. Filin maganadisu na yanzu na eddy wanda aka samar ta hanyar lantarki ta hanyar lantarki ya isa wurin da za a yi zafi, kuma yankin samar da filin maganadisu na yanzu ya kamata ya kasance a cikin coil.

5. Abubuwan da ke cikin coil dole ne su zama jan bututun jan karfe tare da ruwa a ciki don kwantar da hankali, kuma sashin siyar ya kamata a siyar da shi.

Dalilin babban injin dumama:

1. Maganin zafi: partially ko gaba ɗaya hardening da quenching, taushi annealing, damuwa kau, da zafi shigar da daban-daban karafa.

2. Zafafan ƙirƙira: ƙirƙira gabaɗayan ƙirƙira, juzu’i na ɓarna, taken zafi, mirgina mai zafi.

3. Welding: brazing na daban-daban karfe kayayyakin, waldi na daban-daban ruwan wukake da kuma gani ruwan wukake, waldi na karfe bututu, jan karfe bututu, PC jirgin lantarki soldering, waldi na iri ɗaya irin dissimilar karafa.

4. Karfe smelting: (vacuum) smelting, simintin gyaran kafa da evaporation shafi na zinariya, azurfa, jan karfe, baƙin ƙarfe, aluminum da sauran karafa.

5. Sauran aikace-aikace na high-mita dumama inji: semiconductor guda crystal girma, thermal hadin gwiwa, kwalban bakin zafi sealing, hakori fata zafi sealing, foda shafi, karfe implantation robobi, jiki da kuma likita aikace-aikace.