Functional characteristics of エポキシ樹脂固定具

1. Various forms: various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications on the form, and the range can be from very low viscosity to high melting point solids.

2.便利な硬化：さまざまな硬化剤を選択すると、エポキシ樹脂システムは0〜180℃の温度範囲で硬化できます。

3. Strong adhesion: The inherent polar hydroxyl and ether bonds in the molecular chain of epoxy resin make it highly adhesive to various substances. The shrinkage of epoxy resin is low when curing, and the internal stress generated is small, which also helps to improve the adhesion strength.

4. Low shrinkage: The reaction of epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy group in resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage during curing.

5.機械的特性：硬化エポキシ樹脂システムは優れた機械的特性を備えています。

6.電気的特性：硬化エポキシ樹脂システムは、高い誘電特性、表面漏れ抵抗、および耐アーク性を備えた優れた絶縁材料です。

7. Chemical stability: Generally, the cured epoxy resin system has excellent alkali resistance, acid resistance and solvent resistance. Like other properties of the cured epoxy system, the chemical stability also depends on the selected resin and curing agent. Appropriate selection of epoxy resin and curing agent can make it have special chemical stability.