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FR4 board epoxy board

FR4 board epoxy board

​FR4 board epoxy board is also known as epoxy glass fiber board, epoxy phenolic laminated glass cloth board, model 3240, epoxy resin generally refers to an organic polymer compound containing two or more epoxy groups in the molecule , except for a few, their relative molecular mass is not high. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or cyclic structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble and infusible polymers with a three-way network structure.

Application Features:

1. Various forms. A wide variety of resins, curing agents, and modifier systems are available to suit virtually every application’s form requirements, ranging from very low viscosities to high melting point solids.

2. Easy to cure. Using a variety of curing agents, epoxy resin systems can be cured in the temperature range of 0 to 180 °C.

3. Strong adhesion. The existence of polar hydroxyl and ether bonds inherent in the molecular chain of epoxy resin makes it have high adhesion to various substances. Epoxy resins have low shrinkage when cured and generate little internal stress, which also contributes to improved adhesion strength.

4. Low shrinkage. The reaction of the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization of epoxy groups in the resin molecule, without the release of water or other volatile by-products. They show very low shrinkage (less than 2%) during curing compared to unsaturated polyester resins and phenolic resins.

  1. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.