Epoksiehars isolasie bord tegniese aanwysers

Generally speaking, the grade of the insulating board is nie ‘n tegniese graad nie, maar die hoë temperatuur weerstandsgraad van die isolerende materiaal. Die isolerende eienskappe van isolerende materiale is nou verwant aan temperatuur. Hoe hoër die temperatuur, hoe slegter is die isolerende eienskappe van die isolerende materiaal. Om die diëlektriese sterkte te verseker, het elke isolerende materiaal ‘n toepaslike maksimum toelaatbare werkstemperatuur. Onder hierdie temperatuur kan dit vir ‘n lang tyd veilig gebruik word. As dit hierdie temperatuur oorskry, sal dit vinnig verouder. Volgens die mate van hittebestandheid word isolasiemateriaal in Y, A, E, B, F, H, C en ander grade verdeel. Byvoorbeeld, die maksimum toelaatbare werkstemperatuur van Klas A-isolasiemateriaal is 105°C, en die meeste van die isolerende materiale in algemeen gebruikte verspreidingstransformators en motors behoort aan Klas A, soos epoksieharsisolasieborde ensovoorts.

Insulation temperature class A class E class B class F class H class

Maximum allowable temperature (℃) 105 120 130 155 180

Winding temperature rise limit (K) 60 75 80 100 125

Performance reference temperature (℃) 80 95 100 120 145

Next, I will take you to learn other related knowledge of epoxy resin board:

The epoxy resin board is made of glass fiber cloth bonded with epoxy resin and heated and pressed. The model is 3240. It has high mechanical properties at medium temperature and stable electrical properties at high temperature. It is suitable for high-insulation structural parts for machinery, electrical appliances and electronics, with high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistance class F (155 degrees).

In the raw material of epoxy resin board, epoxy resin generally refers to organic polymer compounds containing two or more epoxy groups in the molecule. Except for a few, their relative molecular mass is not high. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or cyclic structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble and infusible polymers with a three-way network structure.

1. Spesifikasie dikte: 0.5~100mm

2. Regular specification: 1000mm*2000mm

3. Kleur: geel

4. Plek van oorsprong: Binnelands

5. It is heated and deformed at a high temperature of 180 °C. Generally, it is not heated together with other metals, which may cause deformation of the metal sheet.