Epoxy resin insulation board technical indicators

Generally speaking, the grade of the insulating board is not a technical grade, but the high temperature resistance grade of the insulating material. The insulating properties of insulating materials are closely related to temperature. The higher the temperature, the worse the insulating properties of the insulating material. In order to ensure the dielectric strength, each insulating material has an appropriate maximum allowable working temperature. Below this temperature, it can be used safely for a long time. If it exceeds this temperature, it will age rapidly. According to the degree of heat resistance, insulating materials are divided into Y, A, E, B, F, H, C and other grades. For example, the maximum allowable working temperature of Class A insulating materials is 105°C, and most of the insulating materials in commonly used distribution transformers and motors belong to Class A, such as epoxy resin insulating boards and so on.

Insulation temperature class A class E class B class F class H class

Maximum allowable temperature (℃) 105 120 130 155 180

Winding temperature rise limit (K) 60 75 80 100 125

Performance reference temperature (℃) 80 95 100 120 145

Next, I will take you to learn other related knowledge of epoxy resin board:

The epoxy resin board is made of glass fiber cloth bonded with epoxy resin and heated and pressed. The model is 3240. It has high mechanical properties at medium temperature and stable electrical properties at high temperature. It is suitable for high-insulation structural parts for machinery, electrical appliances and electronics, with high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistance class F (155 degrees).

In the raw material of epoxy resin board, epoxy resin generally refers to organic polymer compounds containing two or more epoxy groups in the molecule. Except for a few, their relative molecular mass is not high. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or cyclic structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble and infusible polymers with a three-way network structure.

1. Tlhaloso botenya: 0.5～100mm

2. Regular specification: 1000mm*2000mm

3. Mmala: mosehla

4. Sebaka sa Tšimoloho: Lapeng

5. It is heated and deformed at a high temperature of 180 °C. Generally, it is not heated together with other metals, which may cause deformation of the metal sheet.