Izinqumo zokumelana nezinga lokushisa ibhodi le-mica

Ukumelana nokushisa kwebhodi le-mica akuxhomeki ezintweni zayo, kodwa ku-substrate esetshenzisiwe. Ingabe i-silicone, i-epoxy, noma i-shellac.

Ibhodi le-Silicone mica yibhodi le-mica langempela elimelana nokushisa okuphezulu. Ukumelana kwayo nezinga lokushisa ngokuvamile kungafinyelela ngaphezu kuka-500 degrees Celsius. Ngokuqondene nebhodi le-mica eline-epoxy glue, siyazi ukuthi i-epoxy glue izothambisa ngama-degree angu-150. Kucatshangwa ukuthi uma ibhodi ye-mica ene-epoxy resin glue isetshenziswa, ingaba kanjani ibhodi le-mica eliphikisana nokushisa okuphezulu. Ibhodi le-Shellac mica ngokuvamile lilungele izinto zikagesi, futhi ukusebenza kukagesi kunamandla. Ukumelana nokushisa kukude nokumelana nokushisa kwebhodi le-silicone mica.