Reaction between epoxy resin of ibhodi le-mica and curing agent

The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization in the epoxy resin molecule. Will not release water or other volatile by-products. Compared with unsaturated polyester resin and phenolic resin, cured epoxy resin system has excellent mechanical properties. But the overall performance is not as good as mica board.