Karakteristik aplikasyon nan tib epoksidik fib vè:

1. Various methods. Various resins, curing agents, and modifier systems can simply adapt to the requirements of various applications, and their scale can range from extremely low viscosity to high melting point solids.

2. Convenient curing. Using various curing agents, the epoxy resin system can be cured within a temperature range of 0～180℃.

3. Adhesion fò. Egzistans idroksil polè ak kosyon etè [1] nannan nan chèn molekilè nan résine epoksidik fè li gen adezyon segondè nan divès sibstans. Mantèg résine epoksidik la ba lè geri, ak estrès entèn pwodwi a piti, ki ede tou amelyore fòs adezyon an.

4. Low shortening. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shortening (less than 2%) during the curing process.

1. Mechanical function. The cured epoxy resin system has excellent mechanical functions.