Karakteristik aplikasi tabung serat kaca epoksi:

1. Various methods. Various resins, curing agents, and modifier systems can simply adapt to the requirements of various applications, and their scale can range from extremely low viscosity to high melting point solids.

2. Convenient curing. Using various curing agents, the epoxy resin system can be cured within a temperature range of 0～180℃.

3. Adhesion kuwat. Anane ikatan hidroksil lan eter polar [1] sing ana ing rantai molekul resin epoksi ndadekake adhesi dhuwur kanggo macem-macem zat. Ing shortening saka resin epoxy kurang nalika ngobati, lan kaku internal kui cilik, kang uga mbantu kanggo nambah kekuatan adhesion.

4. Low shortening. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shortening (less than 2%) during the curing process.

1. Mechanical function. The cured epoxy resin system has excellent mechanical functions.