Tabia za maombi ya bomba la nyuzi za glasi ya epoxy:

1. Various methods. Various resins, curing agents, and modifier systems can simply adapt to the requirements of various applications, and their scale can range from extremely low viscosity to high melting point solids.

2. Convenient curing. Using various curing agents, the epoxy resin system can be cured within a temperature range of 0～180℃.

3. Kushikamana kwa nguvu. Kuwepo kwa hidroksili ya polar na bondi ya etha [1] asili katika mnyororo wa molekuli ya resini ya epoksi huifanya kuwa na mshikamano wa juu kwa vitu mbalimbali. Ufupisho wa resin epoxy ni mdogo wakati wa kuponya, na dhiki ya ndani inayozalishwa ni ndogo, ambayo pia husaidia kuboresha nguvu za kujitoa.

4. Low shortening. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shortening (less than 2%) during the curing process.

1. Mechanical function. The cured epoxy resin system has excellent mechanical functions.