Five major product characteristics of 3240エポキシ樹脂ボード

1. Strong adhesion: The existence of polar hydroxyl and ether bond inherent in the molecular chain of epoxy resin makes it have high adhesion to various substances. The shrinkage of epoxy resin is low when curing, and the internal stress generated is small, which also helps to improve the adhesion strength.

2. Convenient curing: Choose a variety of different curing agents, the epoxy resin system can almost be cured in the temperature range of 0-180℃.

3.機械的特性：硬化エポキシ樹脂システムは優れた機械的特性を備えています。

4.さまざまなフォーム：さまざまな樹脂、硬化剤、および改質剤システムは、フォームのさまざまな用途の要件にほぼ適応でき、範囲は極低粘度から高融点固体までです。

5. Low shrinkage: The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage during curing.