Five major product characteristics of 3240 epoxy resin board

1. Strong adhesion: The existence of polar hydroxyl and ether bond inherent in the molecular chain of epoxy resin makes it have high adhesion to various substances. The shrinkage of epoxy resin is low when curing, and the internal stress generated is small, which also helps to improve the adhesion strength.

2. Convenient curing: Choose a variety of different curing agents, the epoxy resin system can almost be cured in the temperature range of 0-180℃.

3. Mechanical properties: Iyo yakarapwa epoxy resin system ine yakanakisa ma mechanical properties.

4. Mafomu akasiyana-siyana: resin dzakasiyana-siyana, mishonga yekurapa, uye magadzirirwo ekugadzirisa anogona kupotsa anoenderana nezvinodiwa zvezvikumbiro zvakasiyana-siyana pafomu, uye huwandu hunogona kubva pakuderera zvakanyanya kusvika kune zvakanyanyisa kunyunguduka.

5. Low shrinkage: The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage during curing.