Kuelewa kikamilifu sifa za matumizi ya bodi ya insulation ya SMC

1. Aina mbalimbali. Resini mbalimbali, mawakala wa kuponya, na mifumo ya kirekebishaji karibu inaweza kukabiliana na mahitaji ya aina mbalimbali za matumizi, na safu zao zinaweza kuanzia mnato wa chini sana hadi yabisi ya kiwango cha juu myeyuko.

2. Convenient curing. Using various curing agents, the insulating board can almost be cured in the temperature range of 0～180℃.

3. Strong adhesion. The inherent hydroxyl and ether bonds in the molecular chain of epoxy resin make it highly adhesive to various substances. The shortening of epoxy resin is low when curing, and the internal stress that occurs is small, which also helps to improve the adhesion strength.

4. Ufupisho wa chini. Mwitikio wa resin ya epoxy na wakala wa kuponya hutumiwa unafanywa na mmenyuko wa kuongeza moja kwa moja au majibu ya upolimishaji wa pete ya kikundi cha epoxy katika molekuli ya resin, na hakuna maji au bidhaa nyingine tete zinazotolewa. Ikilinganishwa na resini za polyester zisizojaa na resini za phenolic, zinaonyesha ufupisho wa chini sana (chini ya 2%) katika mchakato wa kuponya.

5.Sifa za mitambo. Bodi ya insulation ya kutibiwa ina mali bora ya mitambo.