Fully understand the use characteristics of SMC insulation board

1. Various forms. Various resins, curing agents, and modifier systems can almost adapt to the requirements of various forms of use, and their ranges can range from very low viscosity to high melting point solids.

2. Convenient curing. Using various curing agents, the insulating board can almost be cured in the temperature range of 0～180℃.

3. Strong adhesion. The inherent hydroxyl and ether bonds in the molecular chain of epoxy resin make it highly adhesive to various substances. The shortening of epoxy resin is low when curing, and the internal stress that occurs is small, which also helps to improve the adhesion strength.

4. Low shortening. The reaction of the epoxy resin and the curing agent used is carried out by the direct addition reaction or the ring-opening polymerization reaction of the epoxy group in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shortening (less than 2%) in the curing process.

5.Mechanical properties. The cured insulation board has excellent mechanical properties.