Ziqonde ngokugcwele izici zokusetshenziswa zebhodi lokufakwa kwe-SMC

1. Amafomu ahlukahlukene. Ama-resin ahlukahlukene, ama-ejenti elaphayo, kanye nezinhlelo zokulungisa zingacishe zivumelane nezidingo zezinhlobo ezahlukahlukene zokusetshenziswa, futhi ububanzi bazo bungasukela ku-viscosity ephansi kakhulu kuye kokuqinile kwendawo encibilika.

2. Ukwelapha okulula. Ngokusebenzisa ama-ejenti okwelapha ahlukahlukene, ibhodi le-insulating lingacishe lilapheke ebangeni lokushisa elingu-0～180℃.

3. Ukunamathela okuqinile. Amabhondi e-hydroxyl ne-ether ochungechungeni lwemolekyuli ye-epoxy resin ayenza inamathele kakhulu ezintweni ezihlukahlukene. Ukufinyezwa kwe-epoxy resin kuphansi lapho uphulukisa, futhi ukucindezeleka kwangaphakathi okwenzekayo kuncane, okusiza ekuthuthukiseni amandla okunamathela.

4. Ukunciphisa okuphansi. Ukusabela kwe-epoxy resin kanye ne-ejenti yokwelapha esetshenziswayo kwenziwa ukusabela kokwengezwa okuqondile noma ukusabela kwe-polymerization yokuvula indandatho yeqembu le-epoxy ku-molecule ye-resin, futhi awekho amanzi noma eminye imikhiqizo eguquguqukayo ekhishwayo. Uma kuqhathaniswa nezinhlayiya ze-polyester ezingasetshenzisiwe kanye nama-phenolic resins, abonisa ukufinyeza okuphansi kakhulu (ngaphansi kuka-2%) enqubweni yokwelapha.

5.Izakhiwo zemishini. Ibhodi le-insulation board linezinto ezinhle kakhulu zemishini.