Taw qhia rau cov yam ntxwv ntawm epoxy iav fiber board epoxy resin adhesive

1. Yooj yim kho. Xaiv ntau yam sib txawv ntawm cov neeg sawv cev kho kab mob, cov txheej txheem epoxy tuaj yeem yuav luag tau kho hauv qhov kub ntawm 0 ~ 180 ℃.

2. Cov khoom siv dag zog. Cov txheej txheem kho epoxy resin muaj cov cuab yeej zoo heev.

3. Muaj zog nplaum. Cov pab pawg hydroxyl ncov qaumteb qabteb thiab cov ether bonds hauv cov saw hlau molecular ntawm epoxy resins ua rau nws nplaum rau ntau yam tshuaj. Kev nqaim ntawm epoxy resin yog qis thaum kho, thiab kev nyuab siab sab hauv tsim tawm me me, uas tseem pab txhim kho lub zog ua kom khov.

4. Low shrinkage. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are emitted. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage during curing.

5. Ntau hom ntawv. Ntau yam resins, kho tus neeg sawv cev, thiab hloov kho cov txheej txheem tuaj yeem hloov kho kom tau raws li qhov xav tau ntawm ntau daim ntawv thov ntawm daim ntawv, thiab qhov ntau tuaj yeem yog los ntawm qis viscosity mus rau qhov siab melting point khib nyiab.