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Introduction to the characteristics of epoxy glass fiber board epoxy resin adhesive

Chiyambi cha makhalidwe a epoxy galasi CHIKWANGWANI bolodi epoxy resin adhesive

1. Kuchiritsa bwino. Sankhani mitundu yosiyanasiyana ya othandizira akuchiritsa, dongosolo la epoxy resin limatha kuchiritsidwa pamatenthedwe a 0 ~ 180 ℃.

2. Mawotchi katundu. Makina ochiritsidwa a epoxy resin ali ndi mawonekedwe abwino kwambiri.

3. Kumangiriza mwamphamvu. Magulu abwinobwino a polar hydroxyl ndi ma ether omwe amakhala munthawi yamagulu a epoxy resin amawamatira kwambiri pazinthu zosiyanasiyana. Kuchepetsa kwa epoxy resin kumakhala kotsika pochiritsa, ndipo kupsinjika kwamkati komwe kumachitika ndikochepa, komwe kumathandizanso kukulitsa mphamvu yolumikizira.

4. Low shrinkage. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are emitted. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage during curing.

5. Mitundu yosiyanasiyana. Ma resin osiyanasiyana, othandizira kuchiritsa, ndi makina osinthira amatha kusintha kutengera zofunikira zosiyanasiyana pafomuyi, ndipo mitunduyi imatha kukhala yochokera pa mamasukidwe akayendedwe otsika mpaka zolimba kwambiri.