- 03
- Nov
Application characteristics of flame-retardant mica insulating board
ຄໍາຮ້ອງສະຫມັກ characteristics of flame-retardant mica insulating board
1. Convenient curing. Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.
2. Various forms. Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications on the form, and the range can be from extremely low viscosity to high melting point solids.
3. Low shrinkage. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.
4. ຄວາມ ໜຽວ ແໜ້ນ. ກຸ່ມ hydroxyl ຂົ້ວໂລກປະກົດຂຶ້ນແລະພັນທະບັດອີເທີໃນຕ່ອງໂສ້ໂມເລກຸນຂອງຢາງ epoxy ເຮັດໃຫ້ມັນມີຄວາມ ໜຽວ ສູງຕໍ່ກັບສານຕ່າງ various. ການຫົດຕົວຂອງຢາງ epoxy ແມ່ນຕໍ່າເມື່ອປິ່ນປົວ, ແລະຄວາມເຄັ່ງຕຶງພາຍໃນທີ່ຜະລິດອອກມາມີຂະ ໜາດ ນ້ອຍ, ເຊິ່ງຍັງຊ່ວຍປັບປຸງຄວາມແຂງແຮງຂອງການ ໜຽວ.
5. ຄຸນສົມບັດກົນຈັກ. ລະບົບຢາງ epoxy ທີ່ປິ່ນປົວໄດ້ມີຄຸນສົມບັດກົນຈັກທີ່ດີເລີດ.
6. Stable electrical insulation performance. Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise ship, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.