- 03
- Nov
Iimpawu zokusetyenziswa kwebhodi ye-mica insulating-flame-retardant
isicelo iimpawu zebhodi ye-mica insulating-flame-retardant
1. Unyango olulula. Ukusebenzisa ii-agent ezahlukeneyo zokunyanga, inkqubo ye-epoxy resin ingaphantse inyangelwe kuluhlu lobushushu obuyi-0 ~ 180 ℃.
2. Iifomu ezahlukeneyo. Iintlaka ezahlukeneyo, ii-arhente zokunyanga, kunye neenkqubo zokulungisa zingaphantse zilungelelanise iimfuno zezicelo ezahlukeneyo kwifomu, kwaye uluhlu lunokusuka kwi-viscosity ephantsi kakhulu ukuya kwindawo ephezulu yokunyibilika.
3. Ukuncipha okuphantsi. Ukusabela phakathi kwe-epoxy resin kunye ne-agent ephilisayo esetyenzisiweyo iqhutywa ngokuphendula ngokuthe ngqo kokudibanisa okanye ukuvulwa kwe-polymerization reaction yamaqela epoxy kwi-molecule ye-resin, kwaye akukho manzi okanye ezinye iimveliso eziguqukayo ezikhutshwayo. Xa kuthelekiswa neentyantyambo ze-polyester ezingaxutywanga, zibonisa i-shrinkage ephantsi kakhulu (ngaphantsi kwe-2%) ngexesha lokunyanga.
4. Ukunamathela okunamandla. Amaqela e-polar hydroxyl kunye ne-ether bond kwi-molecular chain ye-epoxy resins yenza ukuba inamathele kakhulu kwizinto ezahlukeneyo. Ukuncipha kwe-epoxy resin kusezantsi xa unyanga, kwaye uxinzelelo lwangaphakathi oluvelisiweyo lincinci, olunceda ukuphucula amandla okubambelela.
5. Iipropati zoomatshini. Inkqubo ye-epoxy resin ephilisiweyo ineempawu ezintle kakhulu zoomatshini.
6. Ukusebenza kombane ozinzileyo. Ukuthe tyaba okuhle, umphezulu ogudileyo, akukho mingxunya, ukunyamezelwa kobunzima obudlula umgangatho, ezifanelekileyo kwiimveliso ezifuna ukufakwa okuphezulu kwe-elektroniki, okufana nebhodi yokuqinisa i-FPC, ibhodi enokumelana nobushushu obuphezulu kwiziko letoti, i-carbon diaphragm, inqanawa yohambo oluchanekileyo, isakhelo sovavanyo lwePCB, izixhobo zombane ukwahlula ukwahlukanisa, ipleyiti backing backing, isigubungelo isigubungelo, ukugquma motor, ukuphambuka icoil terminal ibhodi, ibhodi yokufaka iswitshi yombane, njl.