aplikasi characteristics of flame-retardant mica insulating board

1. Convenient curing. Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Various forms. Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications on the form, and the range can be from extremely low viscosity to high melting point solids.

3. Low shrinkage. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. kuat adhesi. Kelompok hidroksil polar alamiah sareng beungkeut éter dina ranté molekul résin epoksi ngajantenkeun napel pisan kana sagala rupa zat. Nyusut résin epoxy kirang nalika ngubaran, sareng setrés internal anu dihasilkeun alit, anu ogé ngabantosan ningkatkeun kakuatan adhesion.

5. Pasipatan mékanis. Sistem résin epoxy anu kapok ngagaduhan sipat mékanis anu saé.

6. Stable electrical insulation performance. Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise ship, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.