Application characteristics of flame-retardant mica insulating board

1. Convenient curing. Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Various forms. Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications on the form, and the range can be from extremely low viscosity to high melting point solids.

3. Low shrinkage. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Strong adhesion. The inherent polar hydroxyl groups and ether bonds in the molecular chain of epoxy resins make it highly adhesive to various substances. The shrinkage of epoxy resin is low when curing, and the internal stress generated is small, which also helps to improve the adhesion strength.

5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.

6. Stable electrical insulation performance. Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise ship, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.