Comparative analysis on the application of mica board and epoxy glass fiber board

Mica board and epoxy glass fiber board are often used in daily life. Today, we will make a comparative analysis of the application of mica board and epoxy glass fiber board. The first is the mica board:

Ibhodi le-mica linamandla amahle kakhulu okugoba nokusebenza kokusebenza. Ibhodi le-mica linamandla okugoba okuphezulu nobulukhuni obuhle kakhulu. Ibhodi le-mica lingacutshungulwa ngezindlela ezahlukahlukene ngaphandle kwe-delamination. Ukusebenza okuhle kwezemvelo, ibhodi le-mica alinawo ama-asbestos, linentuthu encane nephunga uma lifudunyezwa, futhi alinantuthu futhi alinambitheki.

Phakathi kwabo, i-HP-5 hard mica board iyinto enamandla kakhulu yeslab mica plate efana nezinto. Ibhodi le-mica lisengakwazi ukugcina ukusebenza kwalo koqobo ngaphansi kwezimo zokushisa okuphezulu. It is kabanzi emikhakheni elandelayo:

Izinto zasendlini: izinsimbi ezisebenza ngogesi, okomisa izinwele, ama-toasters, abenzi bekhofi, iziko lama-microwave, ama-heater kagesi, njll .;

Metallurgical and chemical industry: power frequency furnaces, induction heating furnaces, electric arc furnaces, injection molding machines, etc. in the metallurgical industry.

Epoxy glass fiber board: Glass fiber cloth is made by heating and pressing with epoxy resin. It has high mechanical performance at medium temperature and stable electrical performance at high temperature. It is suitable for high-insulation structural parts for machinery, electrical appliances and electronics, with high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistance grade F (155 degrees). To

Ukusabela phakathi kwe-epoxy resin kanye ne-ejenti ephulukisayo esetshenziswayo kwenziwa ngokufaka okuqondile ngqo noma ukuvulwa kwendandatho kokuphendula kwamaqembu epoxy ku-molecule ye-resin, futhi awekho amanzi noma eminye imikhiqizo evela ezintekenteke ekhishwayo. Uma kuqhathaniswa nezinhlayiya ze-polyester ezingasetshenziswanga nama-phenolic resins, akhombisa ukuncipha okuphansi kakhulu ngesikhathi sokuphulukiswa. I-epoxy resin system ephulukisiwe inezakhiwo ezinhle kakhulu zomshini. Kepha ukusebenza kukonke akukuhle njengebhodi le-mica.

Izici zohlelo lokusebenza

1. Amafomu ahlukahlukene. Izinhlaka ezahlukahlukene, ama-ejenti aphulukisayo, kanye nezinhlelo zokuguqula cishe zingazivumelanisa nezidingo zezinhlelo zokusebenza ezahlukahlukene kwifomu, futhi ububanzi bungaba kusuka ku-viscosity ephansi kakhulu kuye kokuqina okuphezulu kokuncibilika.

2. Convenient curing. Choose a variety of different curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃. 3. Strong adhesion. The inherent polar hydroxyl groups and ether bonds in the molecular chain of epoxy resins make it highly adhesive to various substances. The shrinkage of epoxy resin is low when curing, and the internal stress generated is small, which also helps to improve the adhesion strength.

Ukucaciswa ukujiya: 0.5 ～ 100mm

Ukucaciswa okujwayelekile: 1000mm * 2000mm

Umbala: ophuzi, amanzi aluhlaza okwesibhakabhaka, omnyama

The hardness of epoxy glass fiber board is greater than that of mica board, but it is resistant to temperature difference.