The meaning of FR4 in FR4 epoxy glass fiber board

FR4 is a code for the grade of flame-retardant materials. It represents a material specification that the resin material must be able to extinguish by itself after burning. It is not a material name, but a material grade. Therefore, it is currently used in general circuit boards. There are many types of FR-4 grade materials, but most of them are composite materials made of so-called Tera-Function epoxy resin, Filler and glass fiber.

NEMA is a material standard stipulated by the American Electrical Manufacturers Association. The corresponding IEC standard is EPGC202. There is no domestic standard corresponding to it.

The closest domestic standard is 3240 epoxy laminated glass cloth board. The corresponding IEC standard of 3240 is EPGC201, and there is only a difference in flame retardancy between EPGC201 and EPGC202. Therefore, it can be simply considered that FR-4 is an improved product of 3240 with enhanced flame retardancy.

FR4 epoxy glass fiber board, the main material is imported prepreg. The colors are white, yellow and green. It still has high mechanical strength at room temperature of 150℃. It has good electrical performance in dry and wet state, flame retardant, used in electrical and electronic Insulation structural parts in other industries are carefully manufactured with imported raw materials, domestic presses and standard technology; the main specifications are 1000*2000 mm 1020mm*1220mm, because of the advantages of raw materials, it guarantees high quality, low price, and timely delivery. It has a solid customer base at home and abroad and enjoys a high reputation.

Application characteristics sharing of FR4 epoxy glass fiber board

1. Various forms. Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications on the form, and the range can be from very low viscosity to high melting point solids.

2. Convenient curing. Choose a variety of different curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

3. Strong adhesion. The inherent polar hydroxyl groups and ether bonds in the molecular chain of epoxy resins make it highly adhesive to various substances. The shrinkage of epoxy resin is low when curing, and the internal stress generated is small, which also helps to improve the adhesion strength.

4. Low shrinkage. The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

1. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.