Analysis of the laminating process of FR4 epoxy glass fiber board

FR4 epoxy glass fiber board can give full play to its mechanical properties under medium temperature; under high temperature environment, it can give full play to its electrical properties. Therefore, due to these characteristics, epoxy board is very suitable for high-insulation structural parts in the electrical and electronic fields. It has higher mechanical strength and resistance to voltage breakdown than the national standard 3240 board.

FR4 epoxy glass fiber board main steps include heating, pressurizing, curing, cooling, demoulding and so on.

About the lamination process of FR4 epoxy glass fiber board

1. Pre-heating stage: Place the epoxy board in a hot press and heat it for 30 minutes at a temperature of about 120°C, so that the epoxy resin and the reinforcing material are fully integrated, and the volatiles are also overflowed. This step is very critical. If the time is too short and the temperature is not enough, it is easy to produce bubbles, if the temperature is too high and the time is too long, the blank will slip out.

2. Hot press molding stage: In this stage, temperature, time, and pressure will have a direct impact on the final product, and these factors must be constantly changing depending on the material. For example, in the case of epoxy phenolic laminated cloth, the temperature is set at about 170°C, and in the case of epoxy silicone glass cloth, the temperature is set at about 200°C. If the board is thinner, lower the heat pressing temperature.

3. Cooling and demoulding: After pressing, put the epoxy board into cold water to cool down, the time is between half an hour and one hour. During this period, attention should be paid to the change of internal stress. Excessive thermal expansion and contraction will cause the laminated board to warp and deform.

1. Post-treatment: This step is to make the performance of the epoxy board more superior. For example, putting the produced board in an oven for heat treatment can eliminate internal stress residue.

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