Kev siv cov yam ntxwv ntawm epoxy cob board khoom

1. Diverse forms, various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

2. Kev kho kom yooj yim: Xaiv ntau yam tshuaj tua kab mob sib txawv, thiab epoxy resin system tuaj yeem kho tau ntawm qhov kub ntawm 0 ~ 180 ℃.

3. Muaj zog adhesion: Lub hav zoov ntawm polar hydroxyl thiab ether daim ntawv cog lus muaj nyob rau hauv cov saw molecular ntawm epoxy resin ua rau nws muaj adhesion siab rau ntau yam khoom. Lub shrinkage ntawm epoxy resin yog tsawg thaum kho, thiab cov kev ntxhov siab sab hauv tsim yog me me, uas kuj pab txhim kho lub zog adhesion.

4. Low shrinkage. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy group in resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Cov khoom siv kho tshuab: Cov txheej txheem kho epoxy resin muaj cov cuab yeej zoo heev.