Litšobotsi tsa kopo ea epoxy resin board dihlahiswa

1. Diverse forms, various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

2. Pheko e bonolo: Khetha mefuta e fapaneng ea mefuta e fapaneng ea pheko, ‘me sistimi ea epoxy resin e ka phekoloa ka mocheso o fapaneng oa 0～180℃.

3. Ho khomarela ka matla: Ho ba teng ha polar hydroxyl le ether bond e leng teng ka har’a ketane ea molek’hule ea epoxy resin e etsa hore e be le ho khomarela holimo ho lintho tse sa tšoaneng. The shrinkage ea epoxy resin e tlaase ha e phekoloa, ‘me khatello ea ka hare e hlahisoang e nyenyane, e thusang ho ntlafatsa matla a ho khomarela.

4. Low shrinkage. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy group in resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Lisebelisoa tsa mechine: Sisteme ea epoxy resin e phekotsoeng e na le lisebelisoa tse ntle haholo tsa mochini.