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Application characteristics of epoxy resin board products

Tilmaamaha codsiga ee looxa xabagta epoxy wax soo saarka

1. Diverse forms, various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

2. Daawaynta habboon: Dooro noocyo kala duwan oo dawooyin ah oo kala duwan, iyo nidaamka resin epoxy waxaa lagu daweyn karaa heerkul ah 0~180℃.

3. adhesion xoog leh: Jiritaanka dabaylaha polar hydroxyl iyo ether bond ee ku jira silsiladda molecular ee xabagta epoxy waxay ka dhigaysaa inay yeelato ku dheggan walxo kala duwan. Hoosudhaca resin epoxy waa hooseeyaa marka la daweynayo, iyo walbahaarka gudaha ka dhasha waa mid yar, kaas oo sidoo kale gacan ka geysta hagaajinta xoogga adhesion.

4. Low shrinkage. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy group in resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Guryaha makaanikada: Nidaamka xajinta epoxy ee la daweeyay wuxuu leeyahay sifooyin farsamo oo aad u fiican.