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Application characteristics of epoxy resin board products

Application characteristics of epoxy resin board products

1. Diverse forms, various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

2. Convenient curing: Choose a variety of different curing agents, and the epoxy resin system can be cured at a temperature range of 0~180℃.

3. Strong adhesion: The existence of polar hydroxyl and ether bond inherent in the molecular chain of epoxy resin makes it have high adhesion to various substances. The shrinkage of epoxy resin is low when curing, and the internal stress generated is small, which also helps to improve the adhesion strength.

4. Low shrinkage. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy group in resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Mechanical properties: The cured epoxy resin system has excellent mechanical properties.