Karakteristik aplikasyon nan tablo résine epoksidik pwodwi

1. Diverse forms, various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

2. Pratik geri: Chwazi yon varyete ajan geri diferan, ak sistèm nan résine epoksidik ka geri nan yon seri tanperati 0 ~ 180 ℃.

3. Bonjan Adhesion: Egzistans idroksil polè ak kosyon etè nannan nan chèn molekilè nan résine epoksidik fè li gen adezyon segondè nan divès sibstans. Kontraksyon an nan résine epoksidik se ba lè geri, ak estrès entèn la pwodwi se ti, ki tou ede amelyore fòs la adezyon.

4. Low shrinkage. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy group in resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Pwopriyete mekanik: sistèm résine epoksidik geri a gen ekselan pwopriyete mekanik.