site logo

Application characteristics of epoxy resin board products

Karakteristik aplikasi saka Papan resin epoksi produk

1. Diverse forms, various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

2. Ngruwat trep: Pilih macem-macem agen ngruwat beda, lan sistem resin epoxy bisa nambani ing sawetara suhu saka 0 ~ 180 ℃.

3. Adhesion kuwat: Anane ikatan hidroksil lan eter polar sing ana ing rantai molekul resin epoksi ndadekake adhesi dhuwur kanggo macem-macem zat. Nyusut resin epoksi kurang nalika ngobati, lan stres internal sing diasilake cilik, sing uga mbantu nambah kekuatan adhesi.

4. Low shrinkage. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy group in resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Sifat mekanik: Sistem resin epoksi sing diobati nduweni sifat mekanik sing apik.