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Application characteristics of epoxy resin board products

應用特點 環氧樹脂板 製品

1. Diverse forms, various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

2、固化方便:選擇多種不同的固化劑,環氧樹脂體係可在0~180℃的溫度範圍內固化。

3、附著力強:環氧樹脂分子鏈中固有的極性羥基和醚鍵的存在,使其對各種物質具有高附著力。 環氧樹脂固化時收縮率低,產生的內應力小,也有助於提高粘接強度。

4. Low shrinkage. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy group in resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5、機械性能:固化後的環氧樹脂體系具有優良的機械性能。