Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. ምቹ ማከሚያ

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. የተለያዩ ቅርጾች

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. ዝቅተኛ መቀነስ

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. ጠንካራ ማጣበቂያ

የኢፖክሲ ሙጫዎች በሞለኪውላዊ ሰንሰለት ውስጥ ያሉት የዋልታ ሃይድሮክሳይል ቡድኖች እና የኤተር ቦንዶች ለተለያዩ ንጥረ ነገሮች በጣም ተጣባቂ ያደርጉታል። በሚታከምበት ጊዜ የ epoxy resin መቀነስ ዝቅተኛ ነው, እና የሚፈጠረው ውስጣዊ ጭንቀት ትንሽ ነው, ይህም የማጣበቅ ጥንካሬን ለማሻሻል ይረዳል.

5. ሜካኒካል ባህሪያት

የተፈወሰው epoxy resin system በጣም ጥሩ የሜካኒካል ባህሪያት አሉት.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.