Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. Удобно втвърдяване

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Различни форми

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. Ниско свиване

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Силна адхезия

Присъщите полярни хидроксилни групи и етерни връзки в молекулярната верига на епоксидните смоли я правят силно адхезивна към различни вещества. Свиването на епоксидната смола е ниско при втвърдяване, а генерираното вътрешно напрежение е малко, което също помага за подобряване на силата на сцепление.

5. Механични свойства

Втвърдената система от епоксидна смола има отлични механични свойства.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.