Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. Qulay quritish

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Har xil shakllar

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. Kam qisqarish

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Kuchli yopishish

Epoksi qatronlarining molekulyar zanjiridagi o’ziga xos qutbli gidroksil guruhlari va efir aloqalari uni turli moddalarga yuqori darajada yopishtiruvchi qiladi. Epoksi qatronining qisqarishi qattiqlashganda past bo’ladi va hosil bo’lgan ichki stress kichikdir, bu ham yopishqoqlikni yaxshilashga yordam beradi.

5. Mexanik xossalari

Davolangan epoksi qatronlar tizimi mukammal mexanik xususiyatlarga ega.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.