Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. Kurapa kwakanaka

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Zvimiro zvakasiyana-siyana

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. Yakaderera shrinkage

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Kubatisisa kwakasimba

Iwo echisikigo polar hydroxyl mapoka uye ether zvisungo mune molecular cheni ye epoxy resins inoita kuti inamire zvakanyanya kune zvakasiyana zvinhu. Iyo shrinkage ye epoxy resin yakaderera kana ichirapa, uye kushushikana kwemukati kunogadzirwa kudiki, izvo zvinobatsirawo kuvandudza kusimba kwekunamatira.

5. Mechanical properties

Iyo yakaporeswa epoxy resin system ine yakanakisa mechaniki zvivakwa.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.