Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. Ngwọta dị mma

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Ụdị dị iche iche

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. Mbelata ala

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Ike dịgide

Otu polar hydroxyl dị n’ime ya na njikọ ether dị na agbụ molekụla nke resin epoxy na-eme ka ọ na-arapara nke ukwuu na ihe dị iche iche. Mbelata nke resin epoxy dị ala mgbe a na-agwọ ya, na nrụgide dị n’ime ahụ nke a na-emepụta dị ntakịrị, nke na-enyekwa aka mee ka ike nke ntanye dịkwuo mma.

5. Mechanical Njirimara

Sistemụ resin epoxy a gwọrọ nwere ọmarịcha ihe eji arụ ọrụ.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.