Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. Curing merenah

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Rupa-rupa wangun

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. Lemes nyusutan

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. adhesion kuat

Gugus hidroksil polar alamiah sareng beungkeut éter dina ranté molekular résin époksi ngajantenkeun napel pisan kana sagala rupa zat. The shrinkage of résin epoxy low nalika curing, sarta stress internal dihasilkeun leutik, nu ogé mantuan pikeun ngaronjatkeun kakuatan adhesion.

5. Sipat mékanis

Sistim résin epoxy kapok boga sipat mékanis alus teuing.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.