Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. پخت راحت

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. اشکال مختلف

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. جمع شدگی کم

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. چسبندگی شدید

گروه های هیدروکسیل قطبی ذاتی و پیوندهای اتری در زنجیره مولکولی رزین های اپوکسی باعث می شود که چسبندگی بالایی به مواد مختلف داشته باشد. انقباض رزین اپوکسی هنگام پخت کم است و تنش داخلی ایجاد شده اندک است که به بهبود استحکام چسبندگی نیز کمک می کند.

5. خواص مکانیکی

سیستم رزین اپوکسی پخت دارای خواص مکانیکی عالی است.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.