Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. Perawatan yang nyaman

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Berbagai bentuk

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. Penyusutan rendah

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Daya rekat yang kuat

Gugus hidroksil polar yang melekat dan ikatan eter dalam rantai molekul resin epoksi membuatnya sangat melekat pada berbagai zat. Penyusutan resin epoksi rendah saat pengawetan, dan tegangan internal yang dihasilkan kecil, yang juga membantu meningkatkan kekuatan adhesi.

5. Sifat mekanik

Sistem resin epoksi yang diawetkan memiliki sifat mekanik yang sangat baik.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.