Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. Kuponya kwa urahisi

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Aina mbalimbali

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. Kupungua kwa chini

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Kushikamana kwa nguvu

Vikundi vya asili vya hidroksili ya polar na vifungo vya etha katika mlolongo wa molekuli ya resini za epoxy huifanya kuwa wambiso sana kwa vitu mbalimbali. Kupungua kwa resin epoxy ni chini wakati wa kuponya, na dhiki ya ndani inayozalishwa ni ndogo, ambayo pia husaidia kuboresha nguvu za kujitoa.

5. Mali ya mitambo

Mfumo wa resin epoxy ulioponywa una mali bora ya mitambo.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.