Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. Dermankirina hêsan

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Formên cihêreng

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. shewitandina kêm

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Pêvek xurt

Komên hîdroksîl ên polar ên xwerû û girêdanên etherê yên di zincîra molekularî ya rezîlên epoksî de wê bi maddeyên cihêreng re pir bi zeliqîne. Kêmbûna rezîna epoksî dema ku sax dibe kêm e, û stresa navxweyî ya ku tê hilberandin piçûk e, ku ev jî dibe alîkar ku hêza adhesionê baştir bibe.

5. Taybetmendiyên mekanîkî

Pergala rezîna epoksî ya paqijkirî xwedan taybetmendiyên mekanîkî yên hêja ye.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.