Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. آسان علاج

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. مختلف شڪلون

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. گھٽ ڇڪڻ

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. مضبوط Adhesion

epoxy resins جي ماليڪيولر زنجير ۾ موروثي پولر هائيڊروڪسيل گروپ ۽ ايٿر بانڊ ان کي مختلف مادن لاءِ تمام گهڻو چپکندڙ بڻائيندا آهن. epoxy resin جي گھٽتائي گھٽ هوندي آهي جڏهن علاج ڪيو ويندو آهي، ۽ اندروني دٻاء پيدا ٿيل ننڍڙو هوندو آهي، جيڪو پڻ Adhesion جي طاقت کي بهتر ڪرڻ ۾ مدد ڪري ٿو.

5. مشيني خاصيتون

علاج ٿيل epoxy resin سسٽم ۾ بهترين مشيني خاصيتون آهن.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.