Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. geri pratik

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2. Divès fòm

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3. Kontraksyon ki ba

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4. Bonjan adezyon

Gwoup idroksil polè nannan yo ak lyezon etè nan chèn molekilè rezin epoksidik fè li trè adezif ak sibstans ki sou divès kalite. Kontraksyon an nan résine epoksidik se ba lè geri, ak estrès entèn la pwodwi se ti, ki tou ede amelyore fòs la adezyon.

5. Pwopriyete mekanik

Sistèm résine epoksidik geri a gen ekselan pwopriyete mekanik.

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.