Application characteristics of flame-retardant insulation board for processing heterogeneous mica parts

1. 固化方便

Using various curing agents, the epoxy resin system can almost be cured in the temperature range of 0 ~ 180 ℃.

2、形式多樣

Various resins, curing agents, and modifier systems can almost adapt to the requirements of various applications, ranging from extremely low viscosity to high melting point solids.

3.低收縮

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins, they show very low shrinkage (less than 2%) during curing.

4.附著力強

環氧樹脂分子鏈中固有的極性羥基和醚鍵，使其對各種物質具有很強的粘附性。 環氧樹脂固化時收縮率低，產生的內應力小，也有助於提高粘接強度。

5. 機械性能

固化後的環氧樹脂體系具有優異的機械性能。

6. Stable electrical insulation

Good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products requiring high-performance electronic insulation, such as FPC reinforcement board, high temperature resistant board for tin furnace, carbon diaphragm, precision cruise star, PCB Test frame, electrical equipment insulation partition, insulation backing plate, transformer insulation, motor insulation, deflection coil terminal board, electronic switch insulation board, etc.