Laminating process of papan mika

The lamination process of mica board is an important process in lamination molding. The lamination process is to match the impregnated tape into a slab according to the pressing thickness requirements, place it in the polished metal template, and place it on the hot press to heat, press, solidify and cool the two layers of templates. , Demoulding, post-processing, etc.

1. Tape cutting. This process is to cut the tape to a certain size. The cutting equipment can be a continuous fixed-length slicer, or it can be cut by hand. For tape cutting, the size is required to be accurate. Stack the cut tapes neatly, stack the tapes with different glue content and fluidity separately, and record and store them for later use.

2. Padanan kain pelekat. Proses pemilihan pita pelekat adalah sangat penting untuk kualiti lamina. Jika pemilihan tidak betul, lamina akan retak dan permukaannya terpercik dan kecacatan lain akan berlaku. Pada lapisan permukaan papan yang dipilih, 2 helai pita pelekat dengan kandungan gam permukaan yang tinggi dan kecairan yang tinggi hendaklah diletakkan pada setiap sisi. Kandungan meruap tidak boleh terlalu besar. Jika kandungan meruap terlalu besar, ia perlu dikeringkan sebelum digunakan.

3. Hot pressing process. The most important process parameters in the pressing process are process parameters, among which the most important process parameters are temperature, pressure and time. Overcome the vapor pressure of the volatiles, make the bonded resin flow, and make the adhesive cloth layers closely contact; prevent the plate from being deformed when it is cooled. The size of the molding pressure is determined according to the curing characteristics of the resin. Usually the epoxy/phenolic laminate is 5.9MPa, and the epoxy sheet is 3.9-5.9MPa.

4.Post-processing. The purpose of the post-treatment is to further cure the resin until it is completely cured, at the same time partially eliminate the internal stress of the product, and improve the bonding performance of the product. The post-treatment of epoxy board and epoxy/phenolic board is kept at a temperature of 130-150℃ for about 150min.