Laminating ndondomeko bolodi la mica

The lamination process of mica board is an important process in lamination molding. The lamination process is to match the impregnated tape into a slab according to the pressing thickness requirements, place it in the polished metal template, and place it on the hot press to heat, press, solidify and cool the two layers of templates. , Demoulding, post-processing, etc.

1. Kudula tepi. Njirayi ndikudula tepiyo mpaka kukula kwake. Zida zodulira zimatha kukhala zodulira kutalika kosalekeza, kapena zitha kudulidwa ndi dzanja. Kudula tepi, kukula kumafunika kukhala kolondola. Ikani matepi odulidwa mwaukhondo, sungani matepiwo okhala ndi zomatira zosiyanasiyana ndi madzimadzi pawokha, ndi kulemba ndi kuwasunga kuti mudzagwiritse ntchito mtsogolo.

2. Zomatira nsalu zofananira. Kusankhidwa kwa tepi yomatira ndikofunikira kwambiri pamtundu wa laminate. Ngati kusankhidwa kuli kosayenera, laminate idzaphwanyidwa ndipo pamwamba pake idzaphwanyidwa ndi zolakwika zina. Pamwamba pa bolodi losankhidwa, mapepala a 2 a tepi yomatira okhala ndi zomatira zapamwamba komanso zamadzimadzi zambiri ziyenera kuikidwa mbali iliyonse. Zosakhazikika siziyenera kukhala zazikulu. Ngati zowonda zili zazikulu kwambiri, ziyenera kuumitsidwa musanagwiritse ntchito.

3. Hot kukanikiza ndondomeko. The zofunika kwambiri ndondomeko magawo mu kukanikiza ndondomeko ndi magawo ndondomeko, pakati zofunika kwambiri ndondomeko magawo ndi kutentha, kuthamanga ndi nthawi. Gonjetsani kupsinjika kwa nthunzi wa zovunda, pangani utomoni womangika, ndikupangitsa kuti zigawo zomatira zigwirizane; kuteteza mbale kuti isapunduke ikazizira. Kukula kwa kukakamiza kowumbidwa kumatsimikiziridwa molingana ndi machiritso a utomoni. Nthawi zambiri epoxy/phenolic laminate ndi 5.9MPa, ndipo epoxy sheet ndi 3.9-5.9MPa.

4.Post-processing. Cholinga cha mankhwala pambuyo pake ndikuchiritsanso utomoni mpaka utachira, nthawi yomweyo kuchotsa pang’onopang’ono kupsinjika kwamkati kwa mankhwalawa, ndikuwongolera magwiridwe antchito azinthu. Kuchiza kwa epoxy board ndi epoxy/phenolic board kumasungidwa kutentha kwa 130-150 ℃ pafupifupi 150min.