Epoxy resin board use characteristics

1. Ntau hom ntawv

Ntau yam resins, curing agents, thiab modifier systems yuav luag hloov mus rau qhov yuav tsum tau ntawm ntau yam kev siv ntawm daim ntawv, thiab qhov ntau yuav yog los ntawm tsawg viscosity mus rau siab melting point solids.

2. Muaj zog adhesion

Lub hauv paus ntsiab lus ntawm polar hydroxyl pawg thiab ether bonds nyob rau hauv cov saw molecular ntawm epoxy resins ua rau nws nplaum heev rau ntau yam khoom. Lub shrinkage ntawm epoxy resin yog tsawg thaum kho, thiab cov kev ntxhov siab sab hauv tsim yog me me, uas kuj pab txhim kho lub zog adhesion.

3. Yooj yim kho

Xaiv ntau yam tshuaj tua kab mob sib txawv, cov txheej txheem epoxy resin tuaj yeem yuav luag kho tau hauv qhov kub ntawm 0 ~ 180 ℃.

4. Tsawg shrinkage

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Mechanical zog

Cov kho epoxy resin system muaj cov cuab yeej zoo heev.

6. Kev ua haujlwm hluav taws xob

Cov txheej txheem kho epoxy resin yog cov khoom siv insulating zoo heev nrog cov khoom siv hluav taws xob siab, qhov dej tsis zoo, thiab arc tsis kam.