Epoxy resin board use characteristics

1. Mefuta e sa tšoaneng

Li-resin tse fapaneng, liakhente tse phekolang, le litsamaiso tsa ho fetola li ka batla li ikamahanya le litlhoko tsa lits’ebetso tse fapaneng foromong, ‘me mefuta e ka ba ho tloha ho viscosity e tlase haholo ho isa ho lintho tse tiileng tse qhibilihang.

2. Ho khomarela ka matla

Lihlopheng tsa tlhaho tsa polar hydroxyl le li-bond tsa ether ka har’a ketane ea molek’hule ea li-epoxy resin li etsa hore e khomarele haholo linthong tse fapaneng. The shrinkage ea epoxy resin e tlaase ha e phekoloa, ‘me khatello ea ka hare e hlahisoang e nyenyane, e thusang ho ntlafatsa matla a ho khomarela.

3. Pheko e bonolo

Khetha mefuta e fapaneng ea mefuta e fapaneng ea pheko, sistimi ea epoxy resin e ka batla e phekoleha maemong a mocheso a 0 ~ 180 ℃.

4. Ho fokotseha ho fokolang

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Thepa ea mechine

Sistimi ea epoxy resin e phekotsoeng e na le thepa e ntle haholo ea mochini.

6. Ts’ebetso ea motlakase

Sistimi ea epoxy resin e phekotsoeng ke sesebelisoa se sireletsang hantle se nang le thepa e phahameng ea dielectric, khanyetso ea ho lutla ha holim’a metsi, le arc resistance.