Epoxy resin board use characteristics

1. Iifomu ezahlukeneyo

Iintlaka ezahlukeneyo, ii-arhente zokunyanga, kunye neenkqubo zokulungisa zingaphantse zilungele iimfuno zezicelo ezahlukeneyo kwifomu, kwaye uluhlu lunokuba lusuka kwi-viscosity ephantsi kakhulu ukuya kwizinto eziqinileyo eziphezulu zokunyibilika.

2. Ukubambelela okuqinileyo

Amaqela endalo epolar hydroxyl kunye neebhondi ze-ether kwikhonkco lemolekyuli yeeresin ze-epoxy ziyenza incamathele kakhulu kwizinto ezahlukeneyo. I-shrinkage ye-epoxy resin iphantsi xa iphilisa, kwaye uxinzelelo lwangaphakathi olwenziwe luncinci, olunceda ekuphuculeni amandla okubambelela.

3. Unyango olulula

Khetha iindidi ezahlukeneyo zokunyanga, inkqubo ye-epoxy resin iphantse yanyangeka kuluhlu lobushushu obuyi-0 ~ 180 ℃.

4. Ukuncipha okuphantsi

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Iimpawu zoomatshini

Inkqubo ye-epoxy resin ephilileyo ineempawu ezibalaseleyo zoomatshini.

6. Ukusebenza kombane

Inkqubo ye-epoxy resin enyangisiweyo yinto egqwesileyo yokugquma eneempawu eziphezulu ze-dielectric, ukumelana nokuvuza komphezulu, kunye nokumelana ne-arc.