Epoxy resin board use characteristics

1. Zvimiro zvakasiyana-siyana

Marezeni akasiyana, anorapa maajenti, uye anogadzirisa masisitimu anogona kupotsa anoenderana nezvinodiwa zvakasiyana-siyana zvekushandisa pafomu, uye huwandu hunogona kubva kubva kuderera zvakanyanya viscosity kusvika kune yakakwira melting point solids.

2. Kubatisisa kwakasimba

Iwo echisikigo polar hydroxyl mapoka uye ether zvisungo mune molecular cheni ye epoxy resins inoita kuti inamire zvakanyanya kune zvakasiyana zvinhu. Iyo shrinkage ye epoxy resin yakaderera kana ichirapa, uye kushushikana kwemukati kunogadzirwa kudiki, izvo zvinobatsirawo kuvandudza kusimba kwekunamatira.

3. Kurapa kwakanaka

Sarudza akasiyana akasiyana ekurapa maajenti, iyo epoxy resin sisitimu inogona kurapa mutembiricha ye0 ~ 180 ℃.

4. Yakaderera shrinkage

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Mechanical properties

Iyo yakaporeswa epoxy resin system ine yakanakisa mechaniki zvivakwa.

6. Kuita kwemagetsi

Iyo yakaporeswa epoxy resin system ndeye yakanakisa insulating zvinhu ine yakakwira dielectric zvivakwa, pamusoro pekudonha kwekudzivirira, uye arc kuramba.